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PFA Laboratory

 1.  Brief Introduction
Physical Failure Analysis is the technique of precisely digging out the root cause of failure. With the usage of physical, chemical technological devices, we can efficiently find the failure mode and mechanism of failure samples from field usage and reliability testing. PFA provides the scientific proof for reliability enhancement. It’s also the key point of searching the failure mechanism and cause during R&D, manufacturing, verification and reliability testing. And it’s the most effective way of increasing the reliability of product.

With the comprehensive and advanced equipment and technology as well as experienced engineers, our laboratory can provide a flexible, precise and efficient failure analysis service according to your needs.

 2.  Scope of services
Serving products
   
--Consumer Electronics Products
    --Photoelectric display products
    --Medical products
    --Household electrical appliances
    --Other products


Service contents
    --
Printed wiring board and components
    --Display (LCD, OLED) and components
    --Window/Cover coatings and paintings
    --Electronic components

 
 3.  Analyzing equipment
PFA laboratory has the first-class equipment, which can meet the analytical requirements of different products, shown as below.

Nondestructive check:
2D X-Ray (Phoenix pcba|analyser) 
According to the samples’ different absorption and reflection properties with different density and thickness, by measuring the samples under high pressure vacuum diode emission X-ray irradiation, the defects in the samples can be detected and analyzed, such as electronic components corrosion, cracks, void in the BGA and so on.

Visual inspection:
Stereomicroscope (Leica S8APO) 
With large field diameter and focus depth and long working distance, the appearance of the different objects can be detected. Three-dimensional observation also can be used for the transparent and semitransparent samples.

Digital 3D microscope (HiRox KH-7700) With large depth of field and high magnification (up to 7000×), the samples can be measured in 2 dimensions (including distance, width, area, angle, radius and so on). 3D microscopic observation and morphology reconstruction can be also used in analyzing the PWB, electronic components, and coarse samples and so on.

Metallurgical microscope (Olympus BX51M) It can observe and analyze the samples (including BGA, microstructure, PWB, IC driver, LCD and OLED and so on) with reflected light while its magnification can be up to 1000x.

Cross-section:
Cutting machine (Struers Secotom-10) 
High precision cutting machine, cutting with diamond wheel, has two cutting modes: manual and automatic. The cutting mode and speed, the sample down feed rate can be selected according to the sample characteristics and customer needs.

Vacuum mounting machine (Struers CitoVac) 
Cold mounting method is used, while the vacuum and mounting time can be adjusted according to the sample features.

Grinding and polishing machine (Struers Labopol-25) 
Semi-automatic grinding and polishing mode.
 

 4.  Test Standards
ASTM E3: Standard Guide for Preparation of Metallographic Specimens

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